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July 2011

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Subject:
From:
"McGee, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, McGee, Michael
Date:
Tue, 12 Jul 2011 12:44:46 -0400
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text/plain
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Cracks are most likely caused by flexing of the assembly after soldering.  Check the depanel and ICT stations.  If the cards are bed of nails tested, check there closely.  Pin placement and hold down can be critical.

-Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of J B Ribeiro
Sent: Tuesday, July 12, 2011 11:24 AM
To: [log in to unmask]
Subject: [TN] Capacitor Crack

Hi to all,

We are problems with capacitor crack (0805).
The crack is 45°, close to solder pad and the initiation crack is from down to top.

What are the solutions to solver the problem?
Thermal Shock, Pick and Place, Depaneling?

What is the checklist to audit my supplier?

thank you a lot

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