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July 2011

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Tue, 12 Jul 2011 07:42:56 -0400
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________________________________

From: TechNet on behalf of Ivan Feng
Sent: Thu 07/07/2011 9:27 PM
To: [log in to unmask]
Subject: Re: [TN] Acceleration Factors for Thermal Cycling



Check this out http://www.dfrsolutions.com/thermal-cycling-to-service-life-correlation/
Hope it helps


Greetings,
Ivan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: 2011?7?8? 8:16
To: [log in to unmask]
Subject: Re: [TN] Acceleration Factors for Thermal Cycling

Hello All,

I posted this during the long weekend and did not get a response. Does anyone have some input on the following?

A colleague asked us the following question and we thought it would be good to post on TechNet.

"Is anyone aware of a spreadsheet that can calculate acceleration factors for conversion of PCB cycles to failure from one thermal cycle (e.g. -40/125C) to another (-20/80C)? Looking at IPC-TR-579 (Round Robin Reliability Evaluation of Small Diameter PTHs in PWBs), it seems like the equations presented in section 7 (e.g. Eq. 6) could be used to do this."

Best regards,

Paul Reid
PWB Inc.




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