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July 2011

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
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Date:
Fri, 1 Jul 2011 13:28:11 +0000
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I don't see the details I'd need but it could be caused by spalling at the UBM.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Steve Gregory <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Fri, 1 Jul 2011 07:58:48 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Steve Gregory <[log in to unmask]>
Subject: Re: [TN] BGA ball dewet from substrate

Good Morning Julie,

I have your picture posted here:

http://stevezeva.homestead.com/Solder_dewet.jpg

That is pretty strange. I have never seen something like that!

Steve

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Thursday, June 30, 2011 8:47 PM
To: [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [TN] BGA ball dewet from substrate

Thank you!  Here it is, Steve.


--------------------------------
Julie Silk
Environmental Compliance Technical Program Manager Agilent Technologies
707-577-4296
[log in to unmask]

-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Thursday, June 30, 2011 5:34 PM
To: TechNet E-Mail Forum; SILK,JULIE (A-Sonoma,ex1)
Cc: Steve Gregory
Subject: RE: [TN] BGA ball dewet from substrate

Julie,

You can send your photograph to Steve Gregory who I've copied and he can post it on his site that is available to all the IPC TN members

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless Network Solutions 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Thursday, June 30, 2011 6:29 PM
To: [log in to unmask]
Subject: Re: [TN] BGA ball dewet from substrate

The substrate pad shows an intermetallic layer, demonstrating that there had been a metallurgical bond.  Also, the surface of both pad and ball are smooth -- not a fracture, but as if reflowed.  I have a good picture from the FA report to share once I figure out how.  I believe that if you were to analyze the very first layer on the BGA substrate pad, it would have a layer of solder.

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