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July 2011

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 7 Jul 2011 14:26:16 -0500
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Hi Steve - my vote would be the ImAg and lead-free assembly choice. All 
three of your options should work with each having both pluses and 
minuses. My preference is to solder to copper rather than nickel if given 
a choice. 

Dave Hillman
Rockwell Collins
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Steven Kelly <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
07/07/2011 12:56 PM
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Steven Kelly <[log in to unmask]>


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Subject
[TN] Leaded or non






Hi All,
I have an 18 layer rigid flex (buried and blind)  that we are preparing to 
put the surface finish on and then assemble.
Lots of BGA's etc.
The BGA's are lead free.
Options:

1)      ENIG and lead free assembly

2)      Immersion silver and lead free assembly

3)      HASL and leaded assembly
Hi end military product.

Thoughts or comments would be appreciated.
Thanks. Steve Kelly

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