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July 2011

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Subject:
From:
Roger Tingler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roger Tingler <[log in to unmask]>
Date:
Thu, 7 Jul 2011 14:18:15 -0400
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text/plain (57 lines)
Steve

3 or how about 4-ENIG and leaded assembly.


Roger Tingler
Methods Engineer
Colonial Circuits
V:800-578-9602 x102
  540-752-5511x102
F:540-301-2050
  540-752-2109
E-mail: [log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, July 07, 2011 1:56 PM
To: [log in to unmask]
Subject: [TN] Leaded or non

Hi All,
I have an 18 layer rigid flex (buried and blind)  that we are preparing to put the surface finish on and then assemble.
Lots of BGA's etc.
The BGA's are lead free.
Options:

1)      ENIG and lead free assembly

2)      Immersion silver and lead free assembly

3)      HASL and leaded assembly
Hi end military product.

Thoughts or comments would be appreciated.
Thanks. Steve Kelly

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