Pete,
Simply evaluate the raw material in line with acceptability standard e.g. 610 and 6012 applicable class. By doing this you will assure the product conditions is acceptable (haloing, solder mask contamination).
The solder mask seem to look ok (from your pictures) but dent in laminate ??
From my experience by giving nonconforming product to ENG to evaluate new design is not the to go as the potential risk involved may have huge impact on the design evaluation, time spend to investigate the fault if identified, etc...
I would be very carefully in taking these boards but this is my opinion.
Regards,
Andy
Sent using BlackBerry®
-----Original Message-----
From: Pete <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Fri, 29 Jul 2011 09:15:27
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
Pete <[log in to unmask]>
Subject: [TN] Fab defects - process or mechanical?
Our assembly vendor is telling us they found a number of defects on a small shipment of fabs. Some of these are a bit odd looking, some are obvious. BUT, two of the pictures show obvious mechanical damage.
http://ipc-technet.groupsite.com/gallery/20826
A little background: boards were quick turn, from a vendor we have used for 20 years with extremely good results. Shipped to Hong Kong, where the vendor couldn't locate them for over 2 weeks. Now they found them, said the vacuum bags were compromised, moisture indicators were pink.
We just need about 35 of these built for internal testing, we don't need long term field reliability. Any ideas what this might be, and would you use them for engineering purposes?
BTW, this is clear soldermask, outer layers are copper planes.
Thanks,
Pete
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