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July 2011

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Subject:
Re: Fab defects - process or mechanical?
From:
"Bush, Jeffrey D. (US SSA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bush, Jeffrey D. (US SSA)
Date:
Fri, 29 Jul 2011 10:51:50 -0400
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Good deal of lamination dents - also appears to be delam with larger holes and slots - both may routed depending on hole size and this could indicate some issue in intralam bond strengths.  Need a micro section to see where this condition is indicated.   

Jeffrey Bush
BAE Systems Incorporated 
Electronic Systems Division
IS&R - Space Products and Systems
P.O. Box 868, MER24-01G43
Nashua, NH 03061-0868
Office +1 603.885.8137
Mobile +1 603.318.8056
Fax +1 603.885.5258

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete
Sent: Friday, July 29, 2011 10:15 AM
To: [log in to unmask]
Subject: [TN] Fab defects - process or mechanical?

Our assembly vendor is telling us they found a number of defects on a small shipment of fabs.  Some of these are a bit odd looking, some are obvious.  BUT, two of the pictures show obvious mechanical damage.

http://ipc-technet.groupsite.com/gallery/20826

A little background:  boards were quick turn, from a vendor we have used for 20 years with extremely good results.  Shipped to Hong Kong, where the vendor couldn't locate them for over 2 weeks.  Now they found them, said the vacuum bags were compromised, moisture indicators were pink.

We just need about 35 of these built for internal testing, we don't need long term field reliability.  Any ideas what this might be, and would you use them for engineering purposes?

BTW, this is clear soldermask, outer layers are copper planes.

Thanks,

Pete

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