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July 2011

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Subject:
From:
Tom Burek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tom Burek <[log in to unmask]>
Date:
Thu, 28 Jul 2011 08:51:28 -0600
Content-Type:
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text/plain (317 lines)
Thank you everyone for your responses. I had suspected that copper 
dissolution was the culprit, except for the fact that there is not the 
annular ring deterioration that I would have expected to see.  Checking 
the initial thickness of the barrel with a cross section looks like the 
first step I need to take in this investigation. If copper dissolution is 
the smoking gun, then is reducing the soldering iron temp and making sure 
that the tech's do not place the iron directly on the pin the answer?
I will try to let you know what I find when the issue is resolved so that 
all can benefit from any gained knowledge and experience.

Thank you again for your input.

Tom Burek, CID+




From:   "David D. Hillman" <[log in to unmask]>
To:     <[log in to unmask]>
Date:   07/28/2011 06:03 AM
Subject:        Re: [TN] AW: [TN] Missing PTH Barrels in Connector
Sent by:        TechNet <[log in to unmask]>



Hi Rex - I would agree with you if the cross-section shows that there was 
sufficient copper remaining in the PTH at the manual soldering process but 

I don't know if we can make that assumption. As others have suggested, if 
the PTH copper was "thin" at the pwb fabrication stage and the soldering 
processes prior to manual soldering remove all or nearly all of the 
copper, then it would not be surprising to see the solder wick straight up 

the lead as there is nothing in the PTH for solder to wet. The group's 
recommendation of having a cross-section done would eliminate a number of 
possible root causes right away.

Dave Hillman
Rockwell Collins
[log in to unmask]




Rex Waygood <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
07/28/2011 02:32 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Rex Waygood <[log in to unmask]>


To
<[log in to unmask]>
cc

Subject
Re: [TN] AW: [TN] Missing PTH Barrels in Connector






I would agree.
From the description this is a fast process, the solder wicks straight up 
the pin (one interpretation of this is that 'straight' means 
'immediately'), copper dissolution takes time and wetting to a normal 
barrel would be apparent and then degenerate as the barrel disappears. If 
the barrel were very thin then it could disappear quickly. Have you done 
as recommended and checked your barrels?

We have done experiments to measure dissolution in our wave. It is 
significant and cannot be ignored. Rework cycles make this much worse.

Regards
Rex 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Neifer, Gebhard
Sent: 28 July 2011 07:43
To: [log in to unmask]
Subject: [TN] AW: [TN] Missing PTH Barrels in Connector

As the amount of tin in a reflow and in a hand solder process is limited, 
to me it looks like copper dissolution is probably not the main cause of 
your issue...

Gebhard




-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
Gesendet: Donnerstag, 28. Juli 2011 04:23
An: [log in to unmask]
Betreff: Re: [TN] Missing PTH Barrels in Connector

What is the barrel thickness? Did you etch it and see how is the seed 
layer and subsequent 1st layer adhesion the the PWB? Any etchback can be 
observed? You do not need to answer my question.  As long as you find out 
the answer.
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Thomas Bauer [mailto:[log in to unmask]]
Sent: Wednesday, July 27, 2011 10:07 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Missing PTH Barrels in Connector

Hello

Do you know if there are inner layer pads helping secure the structural 
integrity of the pth? If not I could see how overheating during soldering 
could easily cause the barrel to pull out of the hole.

Thomas


On Jul 27, 2011, at 5:42 PM, "Tom Burek" <[log in to unmask]> wrote:

> Hello,
> I have a PCA that hand solders 6 connector pins to an 4 layer PCB 
> assembly.
> The finish on the PCB is Lead Free HASL (SN100CL) and the solder used 
> to hand solder the pins is SAC305.  The hand soldering is performed as 
> a secondary assembly operation after reflow.
> What happens to some of the assemblies, but not all of them, is that 
> the solder will wick straight up the pin, thereby not allowing a Solder 
joint.
> The pin can be pulled right out of the hole, revealing a PTH with no 
> inner barrel.
> Completely wiped out as if it was never there in the first place. 
> This phenomenon is not present on every PCB or every pin of the same 
connector.
> The PCB's are part of a multi-board panel.
>
> As far as I know the PCB started out with a barrel, but I cannot rely 
> on this being the case as I do not believe the technician checks 100% 
> of the PTH's prior to inserting the pin.
>
> Am I looking at excessive heat causing complete Copper Dissolution of 
> the PTH barrel?
> or
> A PCB that may not have a barrel in every hole, part of the PCB 
> fabrication process?
> or
> Any other suggestion as to which direction to head would be appreciated.
>
> Thanks in advance.
>
>
> Tom Burek, CID+
>
>
>
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