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July 2011

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Subject:
From:
Gerry Gagnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerry Gagnon <[log in to unmask]>
Date:
Thu, 21 Jul 2011 15:21:36 -0400
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Hi Chris, The OEM should be able to track down the board supplier. If they can't, then the UL markings on the board can be used to identify the supplier. The board supplier must be identified so they can provide the chemistry used as well as how it was applied. The chemistry supplier should be able to supply you with the information you need regarding the presence of nickel in the deposit as well as opinions on the low cobalt. Good luck, Gerry
 > Date: Thu, 21 Jul 2011 12:21:00 -0400
> From: [log in to unmask]
> Subject: [TN] hard gold verification
> To: [log in to unmask]
> 
> Hello netters
> 
> We are an independent test facility.  Occasionally we are asked to verify hard gold as part of bare board qualifications.
> Our customers in these cases are usually the OEM supply chain QA.  The buyer controls the source and Quality's only prayer is to run some first articles through a 3rd party.
> Our customer's chance of determining the hard gold formula used on his boards is slim to none.  If it weren't for UL, they probably wouldn't even know who supposedly built them.
> 
> Some time ago, we tried Nano-indentation and there is a related TechNet thread.  It didn't work for us.
> I assumed wear studies might be cost prohibitive, so we went to looking for 0.2% cobalt by SEM-EDS.  This has worked nicely, until today.
> 
> Today we have 0.09% Co and 0.07% Ni.  From what I read, 0.1 Co is easily explained by too rapid deposition, and hardness suffers greatly.  The question is whether the Ni is supposed to be there as a hardener or not?  If yes, then 0.16% total is probably in the ballpark.  But what are the chances it just got dragged there?  Does it matter?
> 
> Thanks in advance
> 
> Chris
> 
> 
> Chris Mahanna
> Robisan Laboratory Inc.
> 
> 
> 
> 
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