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July 2011

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 12 Jul 2011 11:46:55 -0700
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Dave,

I agree but I noticed John did not address the concern of soldering or touching up MLCCs with a soldering iron.  He addressed the rest of the soldering processes but did not even mention the thermal gradient concerns that result when applying heat to one side of the MLCC.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, July 12, 2011 9:42 AM
To: [log in to unmask]
Subject: Re: [TN] Capacitor Crack

Hi JB - read this reference paper by John Maxwell - it should be required 
reading for all assembly engineers:

http://www.avx.com/docs/techinfo/cracks.pdf


Dave Hillman
Rockwell Collins
[log in to unmask]



J B Ribeiro <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
07/12/2011 11:23 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
J B Ribeiro <[log in to unmask]>


To
<[log in to unmask]>
cc

Subject
[TN] Capacitor Crack






Hi to all,

We are problems with capacitor crack (0805).
The crack is 45°, close to solder pad and the initiation crack is from 
down to top.

What are the solutions to solver the problem?
Thermal Shock, Pick and Place, Depaneling?

What is the checklist to audit my supplier?

thank you a lot

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