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July 2011

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Tue, 12 Jul 2011 11:54:10 -0500
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It sounds like you have a classic case of "flexure cracks"  My first guess would be depanelization, then board handling, followed by ICT and pick and place would be last unless the pick and place is really out of control.

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of J B Ribeiro
Sent: Tuesday, July 12, 2011 12:24 PM
To: [log in to unmask]
Subject: [TN] Capacitor Crack

Hi to all,

We are problems with capacitor crack (0805).
The crack is 45°, close to solder pad and the initiation crack is from down to top.

What are the solutions to solver the problem?
Thermal Shock, Pick and Place, Depaneling?

What is the checklist to audit my supplier?

thank you a lot

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