彭主席：您好！
      久没有见面，近来可好！
       瓷片电容碎裂以前我碰到和处理过，与厂家有关，不同厂家同样103电容层数也不统一。当然与贴装工艺也有关系。谢谢！
        陈智东
----- Original Message ----- 
From: "Leesha "Lixia" PENG" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 13, 2011 10:34 AM
Subject: [TGAsia] 转发: [TN] Capacitor Crack


> 各位TGAsia坛友，
> 
> TechNet邮件论坛，于1995年建立，目前有850位注册者。以下摘自该论坛的讨论有关陶瓷电容裂纹，推荐的论文可从以下链接下载http://www.avx.com/docs/techinfo/cracks.pdf。如果有坛友知道哪里可以获得此文译稿，或翻译此文，请提交IPC中国，我们可以刊登在《电子工艺技术》杂志。谢谢！
> 
> 提供此链接的David Hillman 认为，所有组装工程师都当阅读此文。
> 
> 
> Thanks and Best Regards
> 
> Leesha PENG 彭丽霞
> GM IPC China
> IPC中国总经理
> 18616593891
> 
> 
> -----邮件原件-----
> 发件人: TechNet [mailto:[log in to unmask]] 代表 [log in to unmask]
> 发送时间: 2011年7月13日 7:51
> 收件人: Technet
> 主题: Re: [TN] Capacitor Crack
> 
> Dave,
> Thanks for the compliment, that old paper was written in 1985 or so and is still true today. If we can get a photo up to see a better bit of advise could be supplied. 
> 
> Regards,
> 
> John Maxwell
> 
> On Tue, 12 Jul 2011 11:42:29 -0500, "David D. Hillman"
> <[log in to unmask]> wrote:
> 
> 
>> Hi JB - read this reference paper by John Maxwell - it should be 
>> required reading for all assembly engineers:
>> 
>> http://www.avx.com/docs/techinfo/cracks.pdf
>> 
>> 
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>> 
>> 
>> 
>> J B Ribeiro <[log in to unmask]> Sent by: TechNet 
>> <[log in to unmask]>
>> 07/12/2011 11:23 AM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to J B Ribeiro 
>> <[log in to unmask]>
>> 
>> 
>> To
>> <[log in to unmask]>
>> cc
>> 
>> Subject
>> [TN] Capacitor Crack
>> 
>> 
>> 
>> Hi to all,
>> 
>> We are problems with capacitor crack (0805).
>> The crack is 45°, close to solder pad and the initiation crack is from 
>> down to top.
>> 
>> What are the solutions to solver the problem?
>> Thermal Shock, Pick and Place, Depaneling?
>> 
>> What is the checklist to audit my supplier?
>> 
>> thank you a lot
>> 
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