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Date: | Mon, 11 Jul 2011 20:31:21 -0500 |
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Hi Fiona,
下面是J-STD-033B.1的内容简介与目录链接,该标准会员价¥195,非会员价¥379,如有需要,敬请与我联系,谢谢!
http://www.ipc.org/TOC/J-STD-033B-1-Chinese.pdf
J-STD-033B.1
对湿度、回流焊敏感的表面贴装器件的处置、包装、发运及使用方法
本标准向SMD制造商和用户提供了标准的表面贴装器件操作、包装、运输和使用方法。所提供的这些方法可避免由于吸收湿气和暴露在再流焊温度下造成的封装损伤,这些损伤会导致合格率和可靠性的降低。通过使用这些程序、以及采用能达到从密封之日算起在密封干燥袋内12个月最短保存期限的干燥包装工艺,即能实现安全无损的再流焊接。由IPC和JEDEC联合开发。全文共17页,于2005年10月正式发布。
Best regards
孟丽红
IPC 爱比西技术咨询(上海)有限公司
TEL:0755-86141219
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发件人: TGAsia [mailto:[log in to unmask]] 代表 Alan Sun
发送时间: 2011年7月12日 8:51
收件人: TGAsia
主题: Re: [TGAsia] Warehouse control
Dear Fiona,
建议参考这份标准,看看是否有帮助:
IPC/JEDEC J-STD-033B.1 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用
Thansk and best regards,
Alan Sun / Quality Supervisor 孙梦华 质量主管
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Chinakor Electronic Systems (Suzhou) Co., Ltd.
忆科华电子系统(苏州)有限公司
苏州工业园区 方达街37号
Cell Phone: 130 138 50128 Fax: +86 512 62888261
MSN ID: [log in to unmask]<mailto:[log in to unmask]> Web site: WWW.IKOR.ES<http://www.IKOR.ES>
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发件人: TGAsia [mailto:[log in to unmask]] 代表 Yin, Fiona
发送时间: 2011年7月11日 22:09
收件人: [log in to unmask]
主题: [TGAsia] Warehouse control
各位专家:
请教一个问题:
对于未拆包的电子元器件(包括主动和被动的)贮存温湿度有何要求,必须按照EPA的要求管控吗?拆包后,贮存条件如何?谢谢!
Best Regards,
Fiona Yin
Quality Manager
Harman/Becker Automotive Electronic Systems (Suzhou) Co., Ltd.
No. 125, Fangzhou Road, SIP.
Suzhou, Jiangsu, China 215024
Phone: +86 512 6763 1540
Fax: +86 512 6763 1502
Mobile: +86 1866 233 7810
Email: [log in to unmask]<mailto:[log in to unmask]>
Web: www.harman.com<http://www.harman.com>
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