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Date: | Wed, 6 Jul 2011 03:09:29 -0500 |
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吴先生您好:
目前关于关于锡膏的标准IPC正在开发中,该标准将分为两个部分:第一部分为锡膏涂覆的要求,第二部分为故障指导指南。在开发完成后我们会将该标准发布,届时会员可以在第一时间免费下载,请留意IPC标准动态 http://www.ipc.org/Status.aspx。同时IPC也会在第一时间发布消息,敬请留意,谢谢。
Thank you & Best regards
NEW:2011年7月北京/10月成都/11月武汉/12月深圳
IPC2011年“热魔”杯手工焊接竞赛各分赛区期待您的参与!
Paul Zong 宗云龙
[cid:[log in to unmask]]
IPC China
发件人: TGAsia [mailto:[log in to unmask]] 代表 YanQiong Wu
发送时间: 2011年7月6日 16:02
收件人: TGAsia
主题: Re: [TGAsia] 錫膏印刷偏移的問題?
Dear alan:
多謝分享!
Dear all:
也請大家分享一下各自的標准!
Best Regards
吴延琼
SMT ENG Department.
LITEON Technology (CZNA) CO., LTD
Tel: +86-0519-83068888-20230
From: Alan Sun [mailto:[log in to unmask]]
Sent: Wednesday, July 06, 2011 2:02 PM
To: Asia Committe Task Group Forum; YanQiong Wu
Subject: [TGAsia] 錫膏印刷偏移的問題?
Dear Wu,
对于锡膏偏移的量,我们公司内部规定为锡膏印刷最大偏移量不超过焊盘宽度的15%,至于出处无从考证。
因为较小的偏移量在回流焊过程中不会显著影响焊锡去润湿元件引脚,锡膏还是可以完全用于器件的焊接。
也可以试着生产一片,参照IPC-A-610 E的8.3章节对元件最终焊接质量予以判定。
不知其他其他公司有何建议,可以共享下。
Thansk and best regards,
Alan Sun / Quality Supervisor 孙梦华 质量主管
[cid:[log in to unmask]]
Chinakor Electronic Systems (Suzhou) Co., Ltd. 忆科华电子系统(苏州)有限公司
Cell Phone: 130 138 50128 Fax: +86 512 62888261 Skype ID: Smhemail Web site: WWW.IKOR.ES<http://www.IKOR.ES>
________________________________
发件人: TGAsia [mailto:[log in to unmask]] 代表 YanQiong Wu
发送时间: 2011年7月6日 12:49
收件人: [log in to unmask]
主题: [TGAsia] 錫膏印刷偏移的問題?
Dear all:
IPC哪份規範中有定義要求錫膏印刷偏移量的標准?
Best Regards
吴延琼
SMT ENG Department.
LITEON Technology (CZNA) CO., LTD
Tel: +86-0519-83068888-20230
Confidential Information:This message is sent to the intended recipient and may contain privileged or confidential information. If you received this transmission in error, please notify the sender with a replying e-mail and delete the message and any attachment.Transmission Caveat and Virus Alert: Internet communications cannot be guaranteed to be timely, secure, error or virus-free. The sender does not accept liability for any errors or omissions.For additional information, please visit our website at www.liteon.com<http://www.liteon.com>
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