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Date: | Thu, 14 Jul 2011 08:56:31 -0400 |
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We are just starting out in Select soldering here- running about six months. I am interested in what other user's have done to qualify and develop the select solder process parameters. We've got an Ersa machine here- no problem with the machine but want to optimize the process).
I don't have the luxury of running production boards to determine the optimum machine parameters to reduce defects (i.e. insufficient solder, solder skips, insufficient topside flow). I was wondering if anyone knew of a commercially available mixed technology test board ( bottom side SMT parts and through hole devices) to run a Design of Experiments. The machine parameters I was going to look at are below:
Selective solder Design of Experiment
Variables
1. Solder pot temp (3 levels)
2. Solder nozzle height to pin Z distance (2 levels)
3. Solder nozzle X/Y speed (3 levels)
4. Z axis speed (2 levels)
5. Flux amount (2 levels)
6. Length of solder tail- max length of continuous solder path without solder dwell(control this by having several start/stop while running a single pass).
7. Lead Length (2 levels)
Noise
1. Lead length versus solder mask clearance/pitch
2. Solder mask type (dry film vs. LPI)
3. Nitrogen purity
4. Board finish (HASL vs. ENIG vs. OSP)
5. Flux type
6. Nozzle wettability
7. Nozzle calibration/axis repeatability
Any assistance or lessons learned would be appreciated.
Best Regards
Tom Gervascio
Staff Manufacturing Engineer- Automated Processes
Lockheed Martin
Ocala Operations
352-687-5442
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