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Date: | Thu, 7 Jul 2011 22:39:34 +0300 |
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If the BGAs are lead free, you should process the lead free technology.
What about the HASL leaf free?
Best regards
Reuven
ROKAH Technologies
The PCB & PCBA chief
Mobile: 972-52-6012018
Mail: [log in to unmask]
ב-7 ביול 2011, בשעה 20:56, Steven Kelly <[log in to unmask]> כתב/ה:
> Hi All,
> I have an 18 layer rigid flex (buried and blind) that we are preparing to put the surface finish on and then assemble.
> Lots of BGA's etc.
> The BGA's are lead free.
> Options:
>
> 1) ENIG and lead free assembly
>
> 2) Immersion silver and lead free assembly
>
> 3) HASL and leaded assembly
> Hi end military product.
>
> Thoughts or comments would be appreciated.
> Thanks. Steve Kelly
>
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