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Tue, 12 Jul 2011 21:34:27 -0500
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Asia Committe Task Group Forum <[log in to unmask]>, "Leesha \"Lixia\" PENG" <[log in to unmask]>
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各位TGAsia坛友,



TechNet邮件论坛,于1995年建立,目前有850位注册者。以下摘自该论坛的讨论有关陶瓷电容裂纹,推荐的论文可从以下链接下载http://www.avx.com/docs/techinfo/cracks.pdf。如果有坛友知道哪里可以获得此文译稿,或翻译此文,请提交IPC中国,我们可以刊登在《电子工艺技术》杂志。谢谢!



提供此链接的David Hillman 认为,所有组装工程师都当阅读此文。





Thanks and Best Regards



Leesha PENG 彭丽霞

GM IPC China

IPC中国总经理

18616593891





-----邮件原件-----

发件人: TechNet [mailto:[log in to unmask]] 代表 [log in to unmask]

发送时间: 2011年7月13日 7:51

收件人: Technet

主题: Re: [TN] Capacitor Crack



Dave,

Thanks for the compliment, that old paper was written in 1985 or so and is still true today. If we can get a photo up to see a better bit of advise could be supplied. 



Regards,



John Maxwell



On Tue, 12 Jul 2011 11:42:29 -0500, "David D. Hillman"

<[log in to unmask]> wrote:





> Hi JB - read this reference paper by John Maxwell - it should be 

> required reading for all assembly engineers:

> 

> http://www.avx.com/docs/techinfo/cracks.pdf

> 

> 

> Dave Hillman

> Rockwell Collins

> [log in to unmask]

> 

> 

> 

> J B Ribeiro <[log in to unmask]> Sent by: TechNet 

> <[log in to unmask]>

> 07/12/2011 11:23 AM

> Please respond to

> TechNet E-Mail Forum <[log in to unmask]>; Please respond to J B Ribeiro 

> <[log in to unmask]>

> 

> 

> To

> <[log in to unmask]>

> cc

> 

> Subject

> [TN] Capacitor Crack

> 

> 

> 

> Hi to all,

> 

> We are problems with capacitor crack (0805).

> The crack is 45°, close to solder pad and the initiation crack is from 

> down to top.

> 

> What are the solutions to solver the problem?

> Thermal Shock, Pick and Place, Depaneling?

> 

> What is the checklist to audit my supplier?

> 

> thank you a lot

> 

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