Hi,
Make sure you use right solder paste for your choice, e.g. with Ag for greater weeting finish.
Andy
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-----Original Message-----
From: "Wenger, George M." <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Thu, 7 Jul 2011 15:42:26
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
"Wenger, George M." <[log in to unmask]>
Subject: Re: [TN] Leaded or non
Dave,
I totally agree with your choice and the reason for it. It certainly has worked for us for 12 years. Although we don't have our products hung on a cell tower in space, we certainly have our products hung on cell towers and building around the world in all kinds of environmental conditions.
Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, July 07, 2011 3:26 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non
Hi Steve - my vote would be the ImAg and lead-free assembly choice. All
three of your options should work with each having both pluses and
minuses. My preference is to solder to copper rather than nickel if given
a choice.
Dave Hillman
Rockwell Collins
[log in to unmask]
Steven Kelly <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/07/2011 12:56 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Steven Kelly <[log in to unmask]>
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Subject
[TN] Leaded or non
Hi All,
I have an 18 layer rigid flex (buried and blind) that we are preparing to
put the surface finish on and then assemble.
Lots of BGA's etc.
The BGA's are lead free.
Options:
1) ENIG and lead free assembly
2) Immersion silver and lead free assembly
3) HASL and leaded assembly
Hi end military product.
Thoughts or comments would be appreciated.
Thanks. Steve Kelly
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