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July 2011

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Thu, 7 Jul 2011 13:35:21 -0700
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TechNet E-Mail Forum <[log in to unmask]>, "Rivera, Raye" <[log in to unmask]>
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I'd go with option 3 and remember to increase your oven profile for the lead-free solder balls. Also be sure to spec the PCB for lead-free temperatures. 

Best regards,
Raye Rivera
 
 
QA Manager · Canoga Perkins · 818-678-3872  · [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, July 07, 2011 1:18 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

Customer supplied the components and these are prototypes so they may change in the future. My CTE's are as good as I can get in a rigid flex and I have already reflowed some x-outs 6 times with no issues - not the world's best test but it tells me something. The BGA's are on the rigid portion of the rigid flex. Regards Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Harp, Ken
Sent: July-07-11 4:05 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

You might want to have a look at IPC-D-279 and IPC-7095.  I'd concur with the re-ball comment, and you should definitely check your CTEs and board-to-BGA temp rises to determine if you have an adequate CTE match (IPC-D-279 provides a modeling tool for this).  Are you installing the BGAs directly on the rigid-flex?

I miss Werner.

- Ken

-----Original Message-----
From: Amol Kane [mailto:[log in to unmask]] 
Sent: Thursday, July 07, 2011 1:00 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

If it’s a hi end military product, how is lead-free acceptable? Can you re-ball to SnPb balls?.....if not,i would go with ImmAg and LF


Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Thursday, July 07, 2011 3:40 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

If the BGAs are lead free, you should process the lead free technology.
What about the HASL leaf free?

Best regards

Reuven 


ROKAH Technologies
The PCB & PCBA chief
Mobile: 972-52-6012018
Mail: [log in to unmask]


á-7 áéåì 2011, áùòä 20:56, Steven Kelly <[log in to unmask]> ëúá/ä:

> Hi All,
> I have an 18 layer rigid flex (buried and blind)  that we are preparing to put the surface finish on and then assemble.
> Lots of BGA's etc.
> The BGA's are lead free.
> Options:
> 
> 1)      ENIG and lead free assembly
> 
> 2)      Immersion silver and lead free assembly
> 
> 3)      HASL and leaded assembly
> Hi end military product.
> 
> Thoughts or comments would be appreciated.
> Thanks. Steve Kelly
> 
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