如果该产品的可靠性要求较高，此批产品只能报废处理；黑焊盘产生一般是由于沉镍金工艺中镍含量超标所致，焊点强度会降低，元件易推掉，且元件掉了之后焊盘上原来看不见的位置也可能是黑的；可以通过切片和EDX来确认是否是黑焊盘.
Regards,
Grace
-- 原邮件 --
2011/06/30, wuhao <[log in to unmask]>
Hi Vince & all ：
补充说明一下：
1. 此板为 ENIG 工艺，图示凭经验判断非锡面氧化
2 .此板在我司波峰焊制成中出现此类不良，此前还需要进行回流焊接，其中波峰焊插
件孔至少10多个，出现问题的地方也不规律，所以可排除元器件不良
前面有位同仁说此类缺陷可以接受，不知道是IPC 中否有相关标准说明，烦请告知，
vendor 方面还在积极处理，但未有更好的方法，因为此前退板给他们做清洗表面处
理，不良率未曾有改善
thanks
wuhao
_____
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Vince Tian
Sent: Thursday, June 30, 2011 5:25 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB 黑焊盘--- 如何对已出现问题的PCB 做相应处理
Hi
如果你是PCB生产商,你可以看看是否是锡面氧化;
如果你是PCBA生产商,为了验证可靠性,你可以尝试可焊性和热冲击实验来决定是否
CONCESSION ACC,更重要的是反馈给PCB厂商.
BR
VINCE
_____
From: TGAsia [mailto:[log in to unmask]] On Behalf Of wuhao
Sent: Thursday, June 30, 2011 2:13 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB 黑焊盘--- 如何对已出现问题的PCB 做相应处理
Dear all :
请教大家！
请问已经出现了黑焊盘的PCB ,怎么处理比较好;也就是说，在焊接前针对已有问题的
PCB ，我们怎么处理能减少这种黑焊盘问题的出现呢?
Best regards,
HAO
IQC Dept.
In-Tech Electronics Ltd.
2 Qihang Industrial Park Haoxiang Road, Shajing,Baoan, Shenzhen,P.R,China
Tel : +86 755 33262633
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