All,

 

I would like to hear  some comments as well as lessons learned from the
experts concerning the basic requirement to dry-bake populated boards
prior to some thru hole connector replacement. The boards are double
sided and are also populated with numerous SMT components, some of which
are moisture sensitive. Solder alloy is SnPb.

 

Our normal process is to dry-bake "PCBs" prior to reflow and so the
question came up if we should also dry-bake the now populated boards
prior to replacement of some thru hole connectors to prevent potential
damage to the PCB and/or surrounding parts.  The connectors will be
removed and replaced using  either one or a combination of a Selective
Solder machine and\or solder pot. If we were doing a BGA replacement
using a hot air machine, we would dry-bake the populated board.

 

Thanks again for the valuable feedback.

-Joe

 


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