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June 2011

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 7 Jun 2011 08:57:41 -0700
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Since you said wave solder process, I'm assuming the pre-heaters and solder wave will be on and functional. This may give you a warm fuzzy on the acceptability of your design/process and at best establish a positive negative, because if you have any failures, you have problems. 
If you want to establish confidence or some statistically sound rational about design/process robustness then use IPC-TM-650, Method 2.6.27.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, June 07, 2011 8:35 AM
To: [log in to unmask]
Subject: [TN] PCB/PWB - Thermal Stress - Solder Float - TM650, 2.6.8

Fellow TechNetters:

   I apologize for multiple post of this inquiry.   I have had no feedback on and would definitely like to have some sort of dialogue on the topic.

Victor,

-----Original Message-----
From: Hernandez, Victor G 
Sent: Monday, June 06, 2011 2:14 PM
To: Joyce Koo
Cc: Hernandez, Victor G
Subject: FW: PWB - Thermal Stress - TM650, 2.6.8

Joyce,

   Any thoughts on this scenario.

Victor,

-----Original Message-----
From: Hernandez, Victor G 
Sent: Monday, June 06, 2011 12:24 PM
To: TechNet E-Mail Forum
Cc: Hernandez, Victor G
Subject: PWB - Thermal Stress - TM650, 2.6.8

Fellow TechNetters:

   How valid would it be to send an entire board, 16X19x0.094 inches, through the wave solder process x number of times, 1x, 2x, 3x, etc., and call it thermal stress.   Also the extracted coupon size are ¾ x 1/2 inches removed with a router .   What are the Pros and Cons with this method of thermal stress in accordance with IPC guidelines.

"X"

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