Fellow TechNetters:
I apologize for multiple post of this inquiry. I have had no feedback on and would definitely like to have some sort of dialogue on the topic.
Victor,
-----Original Message-----
From: Hernandez, Victor G
Sent: Monday, June 06, 2011 2:14 PM
To: Joyce Koo
Cc: Hernandez, Victor G
Subject: FW: PWB - Thermal Stress - TM650, 2.6.8
Joyce,
Any thoughts on this scenario.
Victor,
-----Original Message-----
From: Hernandez, Victor G
Sent: Monday, June 06, 2011 12:24 PM
To: TechNet E-Mail Forum
Cc: Hernandez, Victor G
Subject: PWB - Thermal Stress - TM650, 2.6.8
Fellow TechNetters:
How valid would it be to send an entire board, 16X19x0.094 inches, through the wave solder process x number of times, 1x, 2x, 3x, etc., and call it thermal stress. Also the extracted coupon size are ¾ x 1/2 inches removed with a router . What are the Pros and Cons with this method of thermal stress in accordance with IPC guidelines.
"X"
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