There is a paper done by Speedline (MPM) that discusses board top clamping
and the benefits of their "EdgeLoc" system and shows that top clamping will
negatively affect print quality the closer components are to the top clamp
blades.

http://speedlinetech.com/docs/papers/mpm/EffectOfBoardClamping.pdf

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Monday, June 06, 2011 10:06 AM
To: [log in to unmask]
Subject: Re: [TN] Keep out distance from Sharp edge blade

You are right. fine pitch and very small components should be a distance
from the blades. The reaction/feedback loop of the squeegee pressure from
either directions is also part of the process set-up/control. Stencil
thickness is also part of the "needed" indirect "parameter".

________________________________

From: TechNet on behalf of Ashok Dhawan
Sent: Tue 5/31/2011 7:54 PM
To: [log in to unmask]
Subject: [TN] Keep out distance from Sharp edge blade



Dek printer users,

I was wondering if Dek Printer users have done studies on effect of sharp
edge blades (board clamps) due to lifting of stencil foil from board
surface. The sharp edge blade is 2-3 mils thick.

We noticed paste leaking on lands and sometime causing solder bridges. It is
more noticeable on fine pitch land patterns such as 20 mil or miniature
discretes.

If any Technet expert has developed DFM guidelines on keep out distance ,
Please comment on this posting.

I will appreciate your response on this.


regards


Ashok Dhawan

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