You are right. fine pitch and very small components should be a distance from the blades. The reaction/feedback loop of the squeegee pressure from either directions is also part of the process set-up/control. Stencil thickness is also part of the "needed" indirect "parameter".

________________________________

From: TechNet on behalf of Ashok Dhawan
Sent: Tue 5/31/2011 7:54 PM
To: [log in to unmask]
Subject: [TN] Keep out distance from Sharp edge blade



Dek printer users,

I was wondering if Dek Printer users have done studies on effect of sharp edge blades (board clamps) due to lifting of stencil foil from board surface. The sharp edge blade is 2-3 mils thick.

We noticed paste leaking on lands and sometime causing solder bridges. It is more noticeable on fine pitch land patterns such as 20 mil or miniature discretes.

If any Technet expert has developed DFM guidelines on keep out distance , Please comment on this posting.

I will appreciate your response on this.


regards


Ashok Dhawan

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