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Date: | Mon, 6 Jun 2011 06:53:27 -0500 |
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Fellow TechNetters:
How valid would it be to send an entire board, 16X19x0.094 inches, through the wave solder x number of times, 1x, 2x, 3x, etc., and call it thermal stress. Also the extracted coupons are ¾ x 1/2 inches conducted with a router . What are the Pros and Cons with this method of thermal stress in accordance with IPC guidelines.
"X"
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