Victor,
Never heard of them till now - http://www.semblantglobal.com/
Have you used their process?
Bob
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Friday, June 03, 2011 3:00 PM
To: [log in to unmask]
Subject: Re: [TN] Best Board Finish - beyond gold
How about Semblant.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of MacFadden, Todd
Sent: Friday, June 03, 2011 1:42 PM
To: [log in to unmask]
Subject: Re: [TN] Best Board Finish - beyond gold
Hi Bob and Technetters.
Great discussion. Two questions:
1. How does ENEPIG compare cost-wise with ENIG and ImmAg?
2. How does ENEPIG compare with ENIG in solder joint reliability, particularly drop-test reliability? Is the resulting Ni/Sn intermetallic with ENEPIG better, worse or similar to that of ENIG?
Thanks,
Todd
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob METCALF
Sent: Thursday, June 02, 2011 11:45 AM
To: [log in to unmask]
Subject: Re: [TN] Best Board Finish - beyond gold
Bob,
As the surface for best solderability there is nothing better than a tin
lead solder finish. The only problem is a lot of the OEM's we deal with
are no longer accepting tin lead solder. The lead free solders in the HASL
environment has not gained as wide spread acceptance as everyone thought.
ENEPIG is considered a "universal finish" that is compatible with a wide
range of applications so I see it gaining favor.
I do agree with you; if you can use tin lead HASL then I would go for that
in many applications.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com
Managing Director: Kuldip Johal
This e-mail and any attachments hereto are business documents of Atotech
USA Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
Unauthorized disclosure and/or use of information contained in this
e-mail are prohibited. If you are not the intended recipient, you should
dispose of it and not use, disseminate or copy this message or any other
files transmitted with it.
.
From: "Robert Kondner" <[log in to unmask]>
To: "'TechNet E-Mail Forum'" <[log in to unmask]>, "'Bob METCALF'"
<[log in to unmask]>
Date: 06/02/2011 08:37 AM
Subject: RE: [TN] Best Board Finish - beyond gold
Bob,
As for flatness: once a PCB has paste printed can you even tell what the
finish is? I have never been able to figure out this flatness thing.
As for reliability I think solderability wins every time. Are you telling
me these other finishes have better solderability than, well solder, as
found only in a HASL finish? Has anyone ever seen "Black Pad" with HASL?
There is no Ni so the P cannot be wrong, ever. Right?
I fell like a stick in the mud on my bias towards HASL, I am open to
ideas
here.
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob METCALF
Sent: Thursday, June 02, 2011 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] Best Board Finish - beyond gold
When considering finishes, if the ultimate in reliability and surface
flatness are key considerations, you must give electroless nickel,
electroless palladium, immersion gold (ENEPIG) some consideration.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com
Managing Director: Kuldip Johal
This e-mail and any attachments hereto are business documents of Atotech
USA
Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
Unauthorized disclosure and/or use of information contained in this
e-mail
are prohibited. If you are not the intended recipient, you should dispose
of it and not use, disseminate or copy this message or any other files
transmitted with it.
.
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Date: 06/02/2011 07:46 AM
Subject: Re: [TN] Best Board Finish - beyond gold
Sent by: TechNet <[log in to unmask]>
I agree with everything you say, Barbara. It sounds like you are now on
your
way to making the correct choice.
Stay away from immersion tin.
If you choose immersion silver, refer to both IPC 1601 and IPC 4553 for
storage and handling considerations. They can be managed.
The double-sided process can leave a slight reduction of solderability
with
immersion silver PWBs by the time you are ready to hand solder any PTH
parts, making that more difficult to do, sometimes.
That is why I asked.
Also, if you select Immersion Silver, make sure that your PWB fabricator
has a good plating product, a well controlled process and some experience
with it.
Ditto with ENIG. Especially with ENIG.
Regarding immersion silver, it is susceptible to environments that are
heavy
in sulfides, such as automotive exhaust, rubber processing, or paper
processing. Keep some of these things in mind both from an end-use
environment standpoint and from a storage standpoint. Do not store in
areas
where there are open containers of soaps, fluxes, etc., nearby.
From: Barbara Burcham [mailto:[log in to unmask]]
Sent: Thursday, June 02, 2011 9:22 AM
To: Stadem, Richard D.
Cc: TechNet E-Mail Forum
Subject: Re: [TN] Best Board Finish - beyond gold
Thanks everyone for you imput. What a great group of people!
Richard,
The application will be double sided, fine pitch array components, some
through hole components and going into a shock environment.
I will need to connect with the assemblers to check on flux and paste
compounds. Does this information help? You make an excellent point. Must
have the total picture. I do not know, yet, how long boards will sit on
the
shelf before moving into assembly, either. I do know that shelf life will
also impact this decision.
I do not think that I want to use tin...that hairy growth stuff.
Barbara
On Thu, Jun 2, 2011 at 8:01 AM, Stadem, Richard D. <[log in to unmask]<
mailto:[log in to unmask]>> wrote:
Barbara,
What is the application, board type, component types, etc?
Immersion silver is my personal favorite, but that is completely
irrelevant.
You should choose a board finish dependent upon the application of the
CCA,
whether it has fine-pitch array components, including CSPs, whether it is
double-sided with PTH parts or hand-soldered components, the environment
the
CCA will be used in, the flux type to be used, the alloy that is required,
and several other factors that go into the decision.
Without complete knowledge of all these factors, it is hard for anyone to
answer that question. I can tell you that IAg beats ENIG in cost, but each
finish has strengths and weaknesses. Some definitely have more or less
than
others.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf
Of
Barbara Burcham
Sent: Wednesday, June 01, 2011 8:17 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TN] Best Board Finish - beyond gold Hey Y'all, I am looking for
a
reliable bare board finish that beats the cost of gold.
What experience is out there?
What would you recommend?
Thanks,
Barbara Burcham
pcb Trace Design
[log in to unmask]<mailto:[log in to unmask]>
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