TECHNET Archives

June 2011

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bob Landman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Landman <[log in to unmask]>
Date:
Fri, 3 Jun 2011 01:34:16 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines)
If you are using a tin-lead process then you have no choice, call it rework or repair (maybe we need a new term thanks to this damned RoHS?) whatever... you must re-ball.

SAC solder balls attached with SnPb are a no-no.  I researched this a while ago and fortunately my BGA supplier (Lattice) was convinced to offer both SAC and SnPb.

Fingers, toes and eyes remain crossed they won't change their mind!

Bob Landman
H&L Instruments, LLC

Sent from my iPhone

On Jun 1, 2011, at 3:21 PM, Gerald Bogert <[log in to unmask]> wrote:

> June 1, 2011
> 
> 
> 
> Anyone have technical data to support (or not support) re-balling of
> BGAs to change from SAC balls to Pb balls???
> 
> 
> 
> My understanding is that because of the extra heat cycle involved, BGA
> manufacturers may not stand behind their part warranty if re-balling is
> done.  I also seem to recall a technical poster or paper presented at
> IPC several years ago which I believe indicated a reduction in
> reliability of the part if it is re-balled.
> 
> 
> 
> Also seems to me that if one were to re-ball a BGA, this would be a
> repair and not a reqork process and as such may require specific
> customer approval.
> 
> 
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask] 
> ______________________________________________________________________
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 16.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
> 

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2