Jack,
Not knowing your CC, nor your potting compound, I would say this -
The potting compound may adhere to the CC, but I bet the CC won't adhere to
the board nearly as well as the potting would adhere to the bare board.
CC/PWB interface sounds like a weak interface to me - well, so does the
CC/potting ...
On the other hand, the potting compound may not adhere well to the CC. Not
knowing the form of your assembly, this could also present some real
problems.
I would most likely pot first, then CC [In my mind I picture a high modulus
epoxy-based potting compound and a much much lower modulus CC. Does not
sound like a happy party].
Steve Creswick
http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, June 29, 2011 12:16 PM
To: [log in to unmask]
Subject: Re: [TN] Potting over Conformal Coat?
profound thoughts, sensei...
(thanks)
Another colleague here speculated that the type of potting compound being
used was so "hard" that the conformal coat provided a buffer zone for
thermal cycling.
That was a new concept to me, this is an older product.
onward thru the fog,
Jack
.
On Wed, Jun 29, 2011 at 10:59 AM, <[log in to unmask]> wrote:
>
> Jack you ask a very broad question. I shall use my stock answer of "It
> Depends".
>
> Conformal coating can be applied prior to conformal coating, but you have
> to ask why. Usually your potting material provides your environmental
> protection. Conformal coating is then non-value added. If it is there to
> protect your assembly from the potting material, you probably have the
wrong
> potting material chosen.
>
> Are there constituents in potting compounds that can affect components?
> Sure. There are lots of compounds out there. Choose wisely.
>
> Are there residues that can inhibit potting cure? Absolutely. Clean
> carefully. Test thoroughly. Choose wisely.
>
> I feel like the Knight in Indiana Jones and the Last Crusade....
>
> Doug Pauls
>
>
> *Jack Olson <[log in to unmask]>*
> Sent by: TechNet <[log in to unmask]>
>
> 06/29/2011 10:39 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Jack Olson <[log in to unmask]>
>
> To
> <[log in to unmask]>
> cc
> Subject
> [TN] Potting over Conformal Coat?
>
>
>
>
> Are any of you familiar with conformal coating assemblies before applying
> potting compound?
>
> Are there potting compounds that contain harsh chemicals that could affect
> components?
> or
> Are there residues on boards that can affect the curing properties of
> potting compounds?
>
> I can only find one vague sentence about this in the Working Draft of
> IPC-HDBK-850
> (3.12.9.1 Compatibility)
>
> thanks,
> Jack
>
>
>
>
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|