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June 2011

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Subject:
From:
Eric Christison <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric Christison <[log in to unmask]>
Date:
Mon, 27 Jun 2011 15:41:48 +0100
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http://www.rohacell.com/product/rohacell/en/processing/bonding/pages/default.aspx

See above. From my recollections from 20 years ago I'd use epoxy with a 
low temperature cure.

Good luck.



On 27/06/2011 13:52, Kenneth J. Wood wrote:
> Hi,
> Has anyone used this material before?
>
> http://www.rohacell.com/sites/dc/Downloadcenter/Evonik/Product/ROHACELL/prod
> uct-information/ROHACELL%20Dielectric%20Properties.pdf
>
> I have an antenna that uses this material sandwiched between two FR-4
> panels.
> The panels need to be bonded together but not sure what bonding agent to
> use, any thoughts?
> Thanks
> Ken
>
> _____________________________________
> Kenneth J. Wood
> Saturn PCB Design, Inc.
> www.saturnpcb.com
>
>
>
>
>
>
>
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-- 
Eric Christison
Consumer&  Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

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