Sri,
Can you post pictures of the problem parts? Send them to Steve Gregory at [log in to unmask] Technet strips all attachments.
Also, I am confused when you say MSL 1 tends to aggravate it. To me, this means the parts are Moisture Sensitive Level 1 parts, and when you use them the problem is there, but if you use Moisture Sensitive Level 3 parts (from a different vendor perhaps?) the problem goes away. Is that a correct interpretation? Also, what does post-mold reflow mean?
We all miss Werner.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sri Maganti
Sent: Thursday, June 23, 2011 5:19 PM
To: [log in to unmask]
Subject: [TN] Solder wicking on component topside at 1st level

We are having a strange issue for some time that we are not able to completly lay our hands on in terms of identifying the root cause. We tend to see solder wicking [ shorting of the terminations ] on top of capacitors/resistors after post mold reflow [ not 1st reflow after assembly]. Our efforts indicate that MSL 1 tends to aggreviate it or rather we are able to duplicate the failure mode using MSL1. The devices /process that are in question are MSL3. I am looking to see if we have a guru or rather an expert in this field who we can consult with. Any leads or names of subject matter expert in this diretion will help and truly be appreciated. Obvioulsy we miss warner englemaier to brainstorm on cases like this.

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