We are having a strange issue for some time that we are not able to completly lay our hands on in terms of identifying the root cause. We tend to see solder wicking [ shorting of the terminations ] on top of capacitors/resistors after post mold reflow [ not 1st reflow after assembly]. Our efforts indicate that MSL 1 tends to aggreviate it or rather we are able to duplicate the failure mode using MSL1. The devices /process that are in question are MSL3. I am looking to see if we have a guru or rather an expert in this field who we can consult with. Any leads or names of subject matter expert in this diretion will help and truly be appreciated. Obvioulsy we miss warner englemaier to brainstorm on cases like this.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------