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June 2011

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From:
GRIVON Arnaud <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, GRIVON Arnaud <[log in to unmask]>
Date:
Wed, 22 Jun 2011 17:46:11 +0200
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Dear all,

What would the best repair process to use for strapping two adjacent vias of a 1mm-pitch BGA?
I did not find this situation in the IPC-7711/7721 standard.
Soldering a jumper wire in the two vias at the BGA bottom side looks risky because of the possibility of partially reflowing the BGA joints, but this may not be a real concern for a small wire.
Soldering a chip could be another option, but I am not sure this is an acceptable practice.
Insights welcome. Assume worst case, i.e. requirements to ensure high-reliability and harsh environment.
Thanks in advance.

A. Grivon


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