 
| Subject: | |
| From: | |
| Reply To: | |
| Date: | Mon, 20 Jun 2011 08:59:13 -0400 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Dent in the blank from FOD in layup - tough to see but the dent is visible between the outer pads and filled with epoxy pool. Could be a damaged plate on the edge impacting the sample also.
No issues as long as performance/dimensional conditions are met - no visibility on the extent seen on the PCB - this is coupon and a small sample of the functional area of the board. If you could trace this back to the lamination lot and examine the plates to isolate the event the failure is verified and contained to the coupon.
Jeffrey Bush
BAE Systems Incorporated
IS&R - Space Products and Systems
P.O. Box 868, MER24-116A
Nashua, NH 03061-0868
Office +1 603.885.8137
Mobile +1 603.318.8056
Fax +1 603.885.5258
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, June 20, 2011 8:44 AM
To: [log in to unmask]
Subject: [TN] Have you seen this?
Hi Mordechai,
Sorry I didn't get your photos posted last week, but I have them up now.
Hopefully there will be someone on the list that can offer some input.
http://stevezeva.homestead.com/x-section_1.jpg
http://stevezeva.homestead.com/X-section_2.jpg
Steve
From: Mordechai Kirshenbaum [mailto:[log in to unmask]]
Sent: Wednesday, June 15, 2011 9:10 PM
To: Steve Gregory
Subject: Have you seen this?
Hi Steve
Attached 2 photos of a PCB coupon micro section.
Please post them in your web site.
The A+B coupon (as defined by IPC 2221) is from a 10 layer PCB
with 2 oz copper layers.
The first photo (x-section 1.jpg) is from 2 copper layers adjust to a via
PTH.
as you can note the dielectric thickness changes significantly.
The second photo (x-section 2.jpg) is from a region between 2 vias.
Have you seen similar pictures?
What is the reliability impact?
Best regards
Mordechai Kirshenbaum
MOD, Israel
[log in to unmask]
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|
