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Date: | Fri, 17 Jun 2011 12:59:56 -0400 |
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We've got a customer's PWB that has vias with the barrel either coated with solder mask or epoxy filled, then covered with solder mask. The plugging tends to leave a small protrusion above the copper surface. Some of these locations happen to be centered at MELF locations. During reflow, MELF's shift off the high point.
Prevention / mitigation ideas anyone?
Dick Krug, SSBB, CSMTPE
SMT Process Engineer
Sparton Corporation
30167 Power Line Road
Brooksville, FL 34602-8299
p (352) 540-4012 (Internal Ext. 2012)
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