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June 2011

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Subject:
From:
"Richard D. Krug" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard D. Krug
Date:
Fri, 17 Jun 2011 12:59:56 -0400
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We've got a customer's PWB that has vias with the barrel either coated with solder mask or epoxy filled, then covered with solder mask.  The plugging tends to leave a small protrusion above the copper surface.  Some of these locations happen to be centered at MELF locations.  During reflow, MELF's shift off the high point.  

Prevention / mitigation ideas anyone? 


Dick Krug, SSBB, CSMTPE
SMT Process Engineer
Sparton Corporation
30167 Power Line Road
Brooksville, FL  34602-8299
p (352) 540-4012  (Internal Ext. 2012)
[log in to unmask]

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