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June 2011

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 16 Jun 2011 11:22:24 -0400
Content-Type:
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text/plain (212 lines)
Use low angle light and you will see everything (including something you do not want to know about). My 2 cents.  Good luck. 

-----Original Message-----
From: Forrester, Michael (H USA) [mailto:[log in to unmask]] 
Sent: Thursday, June 16, 2011 11:14 AM
To: Joyce Koo; TechNet E-Mail Forum
Subject: RE: PCBA Inspection for Solder Balls/Splashes

I think it was the stencil not being clean.  But the real question is,
per IPC-A-610E is this considered a defect, since you can not see the
solder "anomalies" without magnification? 


Best Regards,
 
Michael Forrester
Sr. Product Engineer
CSMTPE
 
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT  06804
PH: (203) 740-6452

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: Thursday, June 16, 2011 11:11 AM
To: Forrester, Michael (H USA); TechNet E-Mail Forum
Subject: RE: PCBA Inspection for Solder Balls/Splashes

Webing ususally are very large, same goes with splashes.  Look like your
solder mask may not be cured properly (or your stencil is not cleaned at
bottom).    

-----Original Message-----
From: Forrester, Michael (H USA)
[mailto:[log in to unmask]] 
Sent: Thursday, June 16, 2011 11:06 AM
To: Joyce Koo; TechNet E-Mail Forum
Subject: RE: PCBA Inspection for Solder Balls/Splashes

1st sentence in section 5.2.7.3 Soldering Anomalies - Excess Solder-
Solder Webbing/Splashes:

	"Inspection for solder splashes shall be done without
	magnification." 


Best Regards,
 
Michael Forrester
Sr. Product Engineer
CSMTPE
 
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT  06804
PH: (203) 740-6452

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: Thursday, June 16, 2011 10:36 AM
To: 'TechNet E-Mail Forum'; Forrester, Michael (H USA)
Subject: RE: PCBA Inspection for Solder Balls/Splashes

I thought table 1-2 and 1-3 specified Mag.  I didn't know anything about
no-mag.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Forrester, Michael
(H USA)
Sent: Thursday, June 16, 2011 10:24 AM
To: [log in to unmask]
Subject: [TN] PCBA Inspection for Solder Balls/Splashes

I have a question about solder balls/splashes on PCBAs.  in IPC-A-610E
section 5.2.7.1 it mentions that solder balls and "fines" that are NOT
encapsulated in flux is a defect.
Section 5.2.7.3 mentions that the inspection for said solder anomalies
shall be done with NO magnification.  We have an SMT assembly that is
manufactured with water soluble flux and has two SMT parts hand soldered
to the board with No-Clean.  In reviewing the rework under
magnification, we discovered solder slivers entrapped in the No-Clean
flux that did not violate the minimal electrical clearance.  So far so
good.  I have several assemblies where there are unmelted solder balls
from the paste and solder slivers (4-5 mils) spread all over the PCB NOT
entrapped in any flux.  I can not see them without magnification, so
does that mean that they pass the IPC-A-610E specification?  In thinking
about this, in theory, once the board is put into service all of the
solder anomalies, not entrapped in flux, could shake loose, converge and
create a short?  So hence my confusion between section 5.2.7.1 and
5.2.7.3.  Any thoughts would be appreciated.  Thank you.
 
Best Regards,
 
Michael Forrester
Sr. Product Engineer
CSMTPE
 
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT  06804
PH: (203) 740-6452
 

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