Too all - thanks for the input - there is very good dialog that will help us
understand what is going on here and I appreciate everyones comments.
On Thu, Jun 9, 2011 at 11:11 AM, Steve Gregory <[log in to unmask]>wrote:
> Hi again Gary,
>
> Here's the additional photos that you sent me:
>
> http://stevezeva.homestead.com/good_joint.jpg
>
> http://stevezeva.homestead.com/Good_Joint_next_to_bad.jpg
>
> http://stevezeva.homestead.com/Via_and_Black_PTH_1.jpg
>
> http://stevezeva.homestead.com/Black_PTH_2.jpg
>
> http://stevezeva.homestead.com/Black_Unwetted_PTH__Post_Wave.jpg
>
> Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
> Sent: Thursday, June 09, 2011 11:19 AM
> To: [log in to unmask]
> Subject: Re: [TN] Black Pad?
>
> We run a blank board but it is from a different Lot code and appears to
> solder fine.
> Maybe we try an run one through reflow oven then wave?
>
> To answer some of the other questions -
> Both profiles are in spec
> Reflow Peak at 244 - TAL - 88sec
> overall time is 5 min ramp to peak
>
> Wave -
> Ramp to 140 and soak with .5 Deg/sec increase to 163 for 1.3 min.
> Delta is 10 deg C (big Xfrmr)
> Contact Time - 2.4 Sec
>
>
> On Thu, Jun 9, 2011 at 9:58 AM, Tontis, Theodore <
> [log in to unmask]> wrote:
>
> > Would it be possible to run a bare board through the wave that hasn't
> > been through the reflow process?
> >
> > Ted T.
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
> > Sent: Thursday, June 09, 2011 9:38 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Black Pad?
> >
> > Steve,
> >
> > I agree with your assessment about possible oxidation of Ni 1st pass and
> > dewetting during wave soldering.
> >
> > Regards,
> > George
> > George M. Wenger
> > Senior Principal Reliability / FMA Engineer
> > Andrew Corporation - Wireless Network Solutions
> > 40 Technology Drive, Warren, NJ 07059
> > (908) 546-4531 Office (732) 309-8964 Mobile
> > E-mail: [log in to unmask]
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> > Sent: Thursday, June 09, 2011 9:59 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Black Pad?
> >
> > Hi Gary,
> >
> > I got your pictures this morning, and have them posted now:
> >
> > http://stevezeva.homestead.com/Joint_1.JPG
> >
> > http://stevezeva.homestead.com/Joint_2.JPG
> >
> > http://stevezeva.homestead.com/via.JPG
> >
> > Although the pictures show some non-wetting happening, it's difficult to
> > see
> > what exactly is going on.
> >
> > You say that the component side seems fine, it's just when you're trying
> > to
> > wave solder is when you see the problem. Maybe you have thin gold, and
> > when
> > the boards were fresh, the SMT was able to solder fine. But then after
> > the
> > boards went through reflow, the underlying nickel oxidized so badly that
> > solder wasn't able to wet?
> >
> > Steve
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
> > Sent: Wednesday, June 08, 2011 4:46 PM
> > To: [log in to unmask]
> > Subject: [TN] Black Pad?
> >
> > We have noticed a problem only on ENIG boards in our WAVE process that
> > looks
> > similar to Black Pad but do not know how to identify or where to begin
> > to
> > find a resolution to the problem. We were hoping an expert may have
> > experience in seeing this problem. Here are some facts -
> > 1. Black residue is on the vias and thts on the solder side. Please see
> > the
> > attached images.
> > 2. Component Side SMT Parts do not exhibit the same problems.
> > 3. Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water
> > Based
> > flux
> > 4. THTs will not wet after residues appear (for touch up process)
> > 5. Blowholes appear to accompany the defect but are not always present.
> >
> > Thanks for your help in advance.
> >
> >
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