Hi again Gary,
Here's the additional photos that you sent me:
http://stevezeva.homestead.com/good_joint.jpg
http://stevezeva.homestead.com/Good_Joint_next_to_bad.jpg
http://stevezeva.homestead.com/Via_and_Black_PTH_1.jpg
http://stevezeva.homestead.com/Black_PTH_2.jpg
http://stevezeva.homestead.com/Black_Unwetted_PTH__Post_Wave.jpg
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
Sent: Thursday, June 09, 2011 11:19 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad?
We run a blank board but it is from a different Lot code and appears to
solder fine.
Maybe we try an run one through reflow oven then wave?
To answer some of the other questions -
Both profiles are in spec
Reflow Peak at 244 - TAL - 88sec
overall time is 5 min ramp to peak
Wave -
Ramp to 140 and soak with .5 Deg/sec increase to 163 for 1.3 min.
Delta is 10 deg C (big Xfrmr)
Contact Time - 2.4 Sec
On Thu, Jun 9, 2011 at 9:58 AM, Tontis, Theodore <
[log in to unmask]> wrote:
> Would it be possible to run a bare board through the wave that hasn't
> been through the reflow process?
>
> Ted T.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
> Sent: Thursday, June 09, 2011 9:38 AM
> To: [log in to unmask]
> Subject: Re: [TN] Black Pad?
>
> Steve,
>
> I agree with your assessment about possible oxidation of Ni 1st pass and
> dewetting during wave soldering.
>
> Regards,
> George
> George M. Wenger
> Senior Principal Reliability / FMA Engineer
> Andrew Corporation - Wireless Network Solutions
> 40 Technology Drive, Warren, NJ 07059
> (908) 546-4531 Office (732) 309-8964 Mobile
> E-mail: [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, June 09, 2011 9:59 AM
> To: [log in to unmask]
> Subject: Re: [TN] Black Pad?
>
> Hi Gary,
>
> I got your pictures this morning, and have them posted now:
>
> http://stevezeva.homestead.com/Joint_1.JPG
>
> http://stevezeva.homestead.com/Joint_2.JPG
>
> http://stevezeva.homestead.com/via.JPG
>
> Although the pictures show some non-wetting happening, it's difficult to
> see
> what exactly is going on.
>
> You say that the component side seems fine, it's just when you're trying
> to
> wave solder is when you see the problem. Maybe you have thin gold, and
> when
> the boards were fresh, the SMT was able to solder fine. But then after
> the
> boards went through reflow, the underlying nickel oxidized so badly that
> solder wasn't able to wet?
>
> Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
> Sent: Wednesday, June 08, 2011 4:46 PM
> To: [log in to unmask]
> Subject: [TN] Black Pad?
>
> We have noticed a problem only on ENIG boards in our WAVE process that
> looks
> similar to Black Pad but do not know how to identify or where to begin
> to
> find a resolution to the problem. We were hoping an expert may have
> experience in seeing this problem. Here are some facts -
> 1. Black residue is on the vias and thts on the solder side. Please see
> the
> attached images.
> 2. Component Side SMT Parts do not exhibit the same problems.
> 3. Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water
> Based
> flux
> 4. THTs will not wet after residues appear (for touch up process)
> 5. Blowholes appear to accompany the defect but are not always present.
>
> Thanks for your help in advance.
>
>
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