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June 2011

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From:
Gary Ferrari <[log in to unmask]>
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Date:
Wed, 1 Jun 2011 12:52:08 -0400
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2222, page 17, Figure 9-1

On 6/1/2011 10:18 AM, Micahel T. Handy wrote:
> TechNet, I'm trying to locate a IPC specification for inner plane air gap for pads and holes. I have located in the IPC 2221 specification for pad/ hole annular ring and thermal tie calculations, but not air gap calculations. The obvious consideration for the air gap size are voltage withstanding and capacitance, but this is not mentioned in the IPC-2221. Could some please point me in the right direction?
> Thanks,
> Mike Handy
>
>
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