Are any of you familiar with conformal coating assemblies before applying
potting compound?
Are there potting compounds that contain harsh chemicals that could affect
components?
or
Are there residues on boards that can affect the curing properties of
potting compounds?
I can only find one vague sentence about this in the Working Draft of
IPC-HDBK-850
(3.12.9.1 Compatibility)
thanks,
Jack
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------