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Subject:	关于BGA底部填充胶
From:	Kane Kai LING <[log in to unmask]>
Reply To:	Asia Committe Task Group Forum <[log in to unmask]>, Kane Kai LING <[log in to unmask]>
Date:	Wed, 15 Jun 2011 20:50:35 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Hi ALL,



请问一下BGA底部填充胶的手动操作规范有哪些需要注意的方面及技巧？谢谢。





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