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June 2011

TGAsia@IPC.ORG

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Subject:
From:
"Liu, Jeff" <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Liu, Jeff
Date:
Wed, 15 Jun 2011 09:03:52 +0000
Content-Type:
text/plain
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各位兄弟姐妹们,
喷锡板是否可以烘烤?有些公司规定喷锡板不可以烘烤,原因是怕烘烤造成铜锡金相降低PCB的可焊性,那么是否有IPC的相关标准可以参考?同时,多高的温度和驻留时间会造成PCB的可焊性降低呢?有谁进行过这方面的研究吗?是否可以跟大家分享一下?

Jeff Liu
Quality Assure Dept.
Viasystems (Shanghai) 
Tel: 86 21 6917 9268
e-Mail: [log in to unmask]	

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