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June 2011

TGAsia@IPC.ORG

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Subject:
From:
Billy SHEN <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Billy SHEN <[log in to unmask]>
Date:
Thu, 2 Jun 2011 02:37:08 -0500
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IPC-7526

《模板和错印板的清洗手册》



清洗模板和错印的PCB在表面贴装技术中起着越来越重要的作用。细节距和超细节距连接盘再加之其它先进封装对模板清洗提出了新的要求。焊膏量对细、超细、芯片规模封装、BGA和倒装芯片器件非常关键。模板开口堵塞导致焊膏不充分是形成缺陷的主要原因。本手册包含了关于模板/错印板清洗的基本信息和指南,有助于减少由于清洗方法不正确而导致的缺陷。共24页,2007年2月出版。





NEW:2011年7月北京/10月成都/11月武汉/12月深圳

           IPC2011年“热魔”杯手工焊接竞赛各分赛区期待您的参与!



IPC围脖,实时报道IPC中国动态,欢迎加好友!

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Billy  Shen 沈懿俊

IPC China



发件人: TGAsia [mailto:[log in to unmask]] 代表 Sonic Lu

发送时间: 2011年6月2日 15:32

收件人: TGAsia

主题: Re: [TGAsia] 關於OSP板印刷失敗後清洗的問題





IPC7526



Thanks and Best Regards



Sonic Lu 陆尚

Process Engineer

Autoliv Electronics China (ACE) Co.,Ltd

Tel:  +86-21-67109300-3162



YanQiong Wu <[log in to unmask]<mailto:[log in to unmask]>>

Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]>>



2011-06-02 14:26

Please respond to

Asia Committe Task Group Forum <[log in to unmask]<mailto:[log in to unmask]>>; Please respond to

YanQiong Wu <[log in to unmask]<mailto:[log in to unmask]>>





To



<[log in to unmask]<mailto:[log in to unmask]>>



cc



Subject



Re: [TGAsia] 關於OSP板印刷失敗後清洗的問題















Hi 各位:

       OSP板在印刷失敗後如何清洗,是否有相關的IPC規範?



Best Regards

吴延琼

SMT ENG Department.

LITEON Technology (CZNA) CO., LTD

Tel: +86-0519-83068888-20230

Mobile: +8615295030062





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