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June 2011

TGAsia@IPC.ORG

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Subject:
From:
Solo Yingjun PAN <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Solo Yingjun PAN <[log in to unmask]>
Date:
Tue, 14 Jun 2011 20:56:54 -0500
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text/plain (1 lines)
Snow:



从图片上看,应于Dewetting关系不大,可以取小片样品做可焊性测试看焊锡饱满的情况就可查清。不过你说的焊盘不平整,能否做一下切片图片来看一下,同时也请测一下阻焊油与焊盘的高度差是多少。



供参考。



发件人: TGAsia [mailto:[log in to unmask]] 代表 Chang_lin(b 程長林)

发送时间: 2011年6月14日 15:17

收件人: TGAsia

主题: Re: [TGAsia] ??(HASL)PCB焊?不平有?重的堆??象



你好!

              從圖片上分析:銅含量嚴重超標,形成堆錫現象.

                                            Cu 的管制範圍是0.3%-1.0%



                                                                      建議:每月化驗一次



      Sn :一种银白色可延展的金属元素,主要从锡石中获取。它用于包裹其它金属以防止腐蚀,它也是各种合金,如软焊料、白腊、铅字合金和青铜的一部分。原子序数50;原子量为118.69;熔点231.89=C;沸点2,270=C;比重7.31;



      Cu :一种有韧性、可延展的红棕色金属元素,是热和电的极好导体,广泛用于电线、水管及防腐蚀零件中,其形式可以是纯铜也可以是黄铜或青铜合金。原子序数为29;原子量为63.54;熔点1,083=C;沸点2,595=C;比重8.96;



以上請Fyi   THANKS!

-----Original Message-----

From: TGAsia [mailto:[log in to unmask]]On Behalf Of Snow Fu

Sent: Thursday, June 09, 2011 10:10 AM

To: [log in to unmask]

Subject: Re: [TGAsia] ??(HASL)PCB焊?不平有?重的堆??象

Dear Laya,

能具体说明下吗?

Best Regards

Snow Fu

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Laya Chen

Sent: 2011年6月9日 9:47

To: [log in to unmask]

Subject: Re: [TGAsia] 喷锡(HASL)PCB焊盘不平有严重的堆锡现象



请参考IPC-A-600H。



Best Regards,



Laya Chen 陈燕

Training Coordinator

Microtek Changzhou Laboratories

麦可罗泰克(常州)实验室-PCB、CCL专业检测实验室

Tel: +86 519 85487805

Fax: +86 519 85487810

Email: [log in to unmask]<mailto:[log in to unmask]>

Website:  www.TheTestLab.cn<http://www.thetestlab.cn/>



PCB\CCL专业检测认证实验室:

===  === == == === === === == == === === === === === == ==  == == ===  ===  ===  == ==  === == ===  ==  ===  ==   ===

1) CAF(绝缘潮湿电阻试验); 2)IC(离子色谱分析);  3)PCB、PCBA失效分析;4)可靠性试验(高低温冲击、恒温恒湿、热老化试验、盐雾、振动、冲击、防水等环境试验);

5)PCB全性能、CCL全性能试验(DSC、TMA、TGA、CTI、PCT、SEM、EDS、耐电弧等);6)IPC-600、IPC-610标准培训; 7)德尔福、联合汽车、德国大陆授权、签约机构;

8)UL-PPP资质实验室(UL认证优势:费用优势、时间优势、一对一指导)9)CQC认证 (中国质量认证中心)非金属材料首批签约实验室

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From: TGAsia [mailto:[log in to unmask]] On Behalf Of Snow Fu

Sent: 2011年6月8日 17:01

To: [log in to unmask]

Subject: [TGAsia] 喷锡(HASL)PCB焊盘不平有严重的堆锡现象



请教各位专家,

现在我们有一家PCB生产出的板子PCB焊盘不平有严重的堆锡现象, PCB是无铅喷锡工艺,如图:

请问对PCB的焊盘平整度业界是否有标准定义?

产生堆锡的原因是什么?

最大可接受的堆锡标准是什么?

PCB焊盘不平有严重的堆锡是否会造成PCBA Dewetting(退润湿)吗?



[cid:[log in to unmask]]





Best Regards

Snow Fu

QE Manager / Quality Dept.

Benchmark Electronics (Suzhou) Co., Ltd.

Tel : 86-512-62835580-1603

Mobile: 13771786819





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