Dear Peter：

        Please refer the attachment .



Thank you & Best regards

NEW：2011年7月北京/10月成都/11月武汉/12月深圳

           IPC2011年“热魔”杯手工焊接竞赛各分赛区期待您的参与！

Paul Zong  宗云龙

[cid:[log in to unmask]]

IPC China



发件人: TGAsia [mailto:[log in to unmask]] 代表 Peter Zhou

发送时间: 2011年6月23日 16:42

收件人: TGAsia

主题: Re: [TGAsia] Wave 少锡和连焊困扰





I can not see the attached drawing.



Peter Zhou



Simclar Electronics (SuZhou) Co,. Ltd.

Block C#02-01/08, No.5 XingHan Street

SuZhou Industrial Park, 215021, SuZhou, P.R.China

Tel: +86 512 62521808 (Ext. 607)

Fax: +86 512 67618925

MP: 13913124061

E-mail: [log in to unmask]<mailto:[log in to unmask]>





Thomas Wang <[log in to unmask]<mailto:[log in to unmask]>>

Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]>>



2011-06-23 16:38

Please respond to

Asia Committe Task Group Forum <[log in to unmask]<mailto:[log in to unmask]>>; Please respond to

Thomas Wang <[log in to unmask]<mailto:[log in to unmask]>>





To



<[log in to unmask]<mailto:[log in to unmask]>>



cc



Subject



Re: [TGAsia] Wave 少锡和连焊困扰















Hello Peter：

Thanks for your information!

For this product design reason, we can’t use selective solder for narrow pitch between components!

SMD pad has hole as below:



High thickness body component as below:





Thomas Wang

KECN



From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]>

Sent: Thursday, June 23, 2011 11:19 AM

To: Asia Committe Task Group Forum; Thomas Wang

Subject: Re: [TGAsia] Wave 少锡和连焊困扰





Hello, Thomas:



Could u please kindly take some pictures for us?



According to your descrption, I'd like to suggest that you can think about using selective solder.



Best Regards



Peter Zhou



Simclar Electronics (SuZhou) Co,. Ltd.

Block C#02-01/08, No.5 XingHan Street

SuZhou Industrial Park, 215021, SuZhou, P.R.China

Tel: +86 512 62521808 (Ext. 607)

Fax: +86 512 67618925

MP: 13913124061

E-mail: [log in to unmask]<mailto:[log in to unmask]>

Thomas Wang <[log in to unmask]<mailto:[log in to unmask]>>

Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]>>



2011-06-23 09:42





Please respond to

Asia Committe Task Group Forum <[log in to unmask]<mailto:[log in to unmask]>>; Please respond to

Thomas Wang <[log in to unmask]<mailto:[log in to unmask]>>







To



<[log in to unmask]<mailto:[log in to unmask]>>



cc



Subject



[TGAsia] Wave少锡和连焊困扰





















Hello all：

现有一个3级产品，SMT背面零件为红胶工艺并过Wave：

1 背面贴片零件的焊盘有过孔，Wave焊接后焊锡收缩到孔中，表现为少锡，已完全焊接，但不可接受

2 有一两边引脚的IC，紧随过锡位置有一比较高的零件，不易拖锡造成连焊（不可以改变方向过Wave，

很多类似的两边引脚的IC都有拖锡焊盘，包括该IC）

3 还是该产品，因零件密集且有如上的设计问题，尝试降低预热并降低Wave高度，可以减少少锡但连焊会大量增加，

升高预热并升高Wave高度，可以减少连焊但少锡会大量增加，比较郁闷，请各位赐教，谢谢！



Thomas Wang

KECN



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