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Date: | Wed, 22 Jun 2011 17:46:11 +0200 |
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Dear all,
What would the best repair process to use for strapping two adjacent vias of a 1mm-pitch BGA?
I did not find this situation in the IPC-7711/7721 standard.
Soldering a jumper wire in the two vias at the BGA bottom side looks risky because of the possibility of partially reflowing the BGA joints, but this may not be a real concern for a small wire.
Soldering a chip could be another option, but I am not sure this is an acceptable practice.
Insights welcome. Assume worst case, i.e. requirements to ensure high-reliability and harsh environment.
Thanks in advance.
A. Grivon
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