I had an issue on a couple of assemblies where there was a fine pitch component right on the edge. I got good stencil gasketting with fine pitch components that were 0.25" away from the foil edge. You may also have to increase the cleaning frequency to clean any paste smear on the bottomside of the stencil. The issue with the foil clamps lifting up the stencil is not specific to the DEK machines. It's just the nature of the beast. 

I think DEK and others also offer a foil and clamp-less locating system. Does anybody on the technet have experience using them?

Regards,

Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ashok Dhawan
Sent: Tuesday, May 31, 2011 7:55 AM
To: [log in to unmask]
Subject: [TN] Keep out distance from Sharp edge blade

Dek printer users,

I was wondering if Dek Printer users have done studies on effect of sharp edge blades (board clamps) due to lifting of stencil foil from board surface. The sharp edge blade is 2-3 mils thick.

We noticed paste leaking on lands and sometime causing solder bridges. It is more noticeable on fine pitch land patterns such as 20 mil or miniature discretes.

If any Technet expert has developed DFM guidelines on keep out distance , Please comment on this posting. 

I will appreciate your response on this. 


regards


Ashok Dhawan

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