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Subject:	Keep out distance from Sharp edge blade
From:	Ashok Dhawan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Ashok Dhawan <[log in to unmask]>
Date:	Tue, 31 May 2011 06:54:45 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (26 lines)

Dek printer users,

I was wondering if Dek Printer users have done studies on effect of sharp edge blades (board clamps) due to lifting of stencil foil from board surface. The sharp edge blade is 2-3 mils thick.

We noticed paste leaking on lands and sometime causing solder bridges. It is more noticeable on fine pitch land patterns such as 20 mil or miniature discretes.

If any Technet expert has developed DFM guidelines on keep out distance , Please comment on this posting. 

I will appreciate your response on this. 


regards


Ashok Dhawan

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