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May 2011

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Subject:
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Wed, 18 May 2011 11:17:25 -0400
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Jim
It can be used as a direct substitute within your change control scheme, which may mean no.
Probably depends on how susceptible your design is to the items Paul mentions.
Performance items that we routinely see as (possible) deal breakers:

Controlled impedance space/time variation (remember that a foil lam may swap all layers w.r.t. B/C stage!)
Peel/bond (adhesive strength)
Cratering (cohesive strength)

BTW, other divisions/programs of ITT have several controls in place about this.

Chris


Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James - ES
Sent: Tuesday, May 17, 2011 10:40 AM
To: [log in to unmask]
Subject: [TN] Core vs Foil Lamination

Good Day Technet:
We have a heritage PWB design for a space application where our drawing requires a core laminating process.  One of our suppliers is requesting using foil lamination in lieu of core lamination for registration issues.  Since we qualified the original core lamination, can foil lamination be a direct substitute?

Thanks in advance,

Jim Marsico
ITT Corporation
1500 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
[log in to unmask]<mailto:[log in to unmask]>


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