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May 2011

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Subject:
From:
Gregg Owens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gregg Owens <[log in to unmask]>
Date:
Mon, 16 May 2011 12:46:55 -0700
Content-Type:
text/plain
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text/plain (79 lines)
İlknur:

The short answer is space is exempted due to the reality of tin whiskers which requires lead (Pb) in solder as a preventative mechanism. The J-STD-001 ES specifically PROHIBITS lead-free platings:

0.1.6 Use of Lead-Free Tin The use of components, assemblies,
packaging technology, mechanical hardware, and materials
meeting any of the following conditions shall be
prohibited unless documented and controlled through a User
approved Lead Free Control Plan (LFCP) incorporating
either a replating or hot solder dip (HSD) process that completely
replaces the lead-free tin finish, or a minimum of two
mitigation measures.
. Lead-free Tin platings, metallization, etc., on external
surfaces of parts, mechanical parts, etc., or in internal
cavity surfaces ( i.e.: hybrid, relay crystal cans, MEMS
etc)
. Any components, printed circuit assemblies (PCAs), etc.
assembled with lead-free tin solder alloys except
Sn96.3Ag3.7 (see paragraph 3.2). 

Sorry I am not familiar with RoHS law to steer you wherein it provides an exemption for space products. 

Gregg Owens | Sr. Technical Writer
Wavestream Corporation
 (909) 599-9080 x 484 | [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ilknur Baylakoglu
Sent: Monday, May 16, 2011 6:59 AM
To: [log in to unmask]
Subject: [TN] ROHS compliance for space application products

Hi,

There are exemption in RoHS directive for military applications, but, how about space application products? Are they also need to be RoHS compliant or in exemption?

Thanks for the information....


İlknur Baylakoglu
Chief Researcher
Reliability Group Leader
TUBITAK SPACE Technologies Reserach Institute
T:90 312 210 13 10/1139
F: 90 312 210 13 15
ANKARA-TURKEY


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